AChamarthy

6 ms·

1.
by AChamarthy 3y ago
This is a bit confusing, as one of the special/unique properties of Graphene is that it doesn't have a bandgap. If we're talking about core semiconductor applications, other 2D materials which have much larger bandgaps than t
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by AChamarthy 3y ago
Crimes of the future!
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by AChamarthy 3y ago
To continue the patterning roadmap, many techniques were considered back in the day, including 157 litho v. NIL v. EUV v. Direct Self Assembly. For NIL, the biggest issue was defect density...why NIL found a niche in disk drive applications
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by AChamarthy 3y ago
TSMC shares deep history with ASML via Philips (Philips was the first investor in TSMC, and ASML was started off as a Philips spin off). Most of today's advanced litho (EUV) was actually funded/developed in American labs (Berkeley
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SemiAnalysis: Future of the Transistor(semianalysis.com)
2 points by AChamarthy 4y ago|0 comments
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by AChamarthy 7y ago
https://www.goodreads.com/book/show/16145208-slingshot is a good book that covers Intel/AMD history
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by AChamarthy 7y ago
Beautiful Concept. Recent article about In Sheep's Clothing and Gold Line in LA: https://www.latimes.com/entertainment/music/la-et-ms-hi-fi-b...
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by AChamarthy 7y ago
Will just go in a different direction. Gordon Moore himself alludes to advanced packaging / 3D configurations in his original 1965 paper: "It may prove economical to build large systems out of smaller functions, which are separate
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by AChamarthy 7y ago
2.5D is connecting chips laterally on an interposer. Full 3D IC wafer level Packaging would be stacking wafers on top of each other a in dense, heterogenous, 3D configuration - i.e. "memory near compute" Ex: https://www
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by AChamarthy 7y ago
I'm trying to connect with Don (author) - appreciate an intro if anyone has a good link.
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by AChamarthy 8y ago
Happy to make an intro. My email is in my profile.
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by AChamarthy 8y ago
Have you heard of Molecular Rebar? http://www.molecularrebar.com/ Their CNT patent portfolio is being licensed by a company called Black Diamond Structures, which is a joint venture with SABIC. They’re looking at battery ap
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by AChamarthy 8y ago
In theory, you achieve high power and long charge-discharge lifetimes with graphene-based supercapacitors The Graphene Flagship is focused on developing methods for combining few-layer graphene and silicon nanoparticles to obtain high perfo
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by AChamarthy 8y ago
EU's biggest research initiative is the Graphene Flagship - https://en.wikipedia.org/wiki/Graphene_Flagship Major Conferences - Graphene Week, Mobile World Congress (Barcelona + SF), National Graphene Association
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by AChamarthy 8y ago
Vs. Carbon Fiber, it depends on the application and intended use case Re: aerospace, from a recent report, "Graphene can give multifunctional benefits to composites, including increased mechanical properties and conductivity. To prote
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by AChamarthy 8y ago
https://www.graphenea.com/collections/graphene-products/prod...
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by AChamarthy 8y ago
Many applications of Graphene are already on the market (ex. lighter and stiffer bicycle frames, bicycle tires, sports equipment, electronic inks and paints etc). However, these are based on lower quality Graphene powders or nanoplatelets (
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by AChamarthy 9y ago
Lab 91 | Electrical Engineering, Mechanical Engineering, Materials Science | Austin, TX Newly formed company focused on semiconductor applications of nanomaterials. Currently trying to raise a seed round of capital, but just wanted to post
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by AChamarthy 9y ago
Lab 91 | Electrical Engineering, Mechanical Engineering, Materials Science | Austin, TX Newly formed company focused on semiconductor applications of nanomaterials. Currently trying to raise a seed round of capital, but just wanted to post
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by AChamarthy 9y ago
Lab 91 | Electrical Engineering, Mechanical Engineering, Materials Science | Austin, TX Newly formed company focused on semiconductor applications of nanomaterials. Currently trying to raise a seed round of capital, but just wanted to post