2.5D is connecting chips laterally on an interposer. Full 3D IC wafer level Packaging would be stacking wafers on top of each other a in dense, heterogenous, 3D

2.5D is connecting chips laterally on an interposer. Full 3D IC wafer level Packaging would be stacking wafers on top of each other a in dense, heterogenous, 3D configuration - i.e. "memory near compute" Ex: https://www.kurzweilai.net/radical-new-vertically-integrated-3d-chip-design-combines-computing-and-data-storage https://www.kurzweilai.net/radical-new-vertically-integrated...