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How would tinning those tiny pads not create a massive bridge between them? Does the bridge somehow go away in the reflow phase? (Not familiar with reflow at al
by Hackbraten 1y ago
How would tinning those tiny pads not create a massive bridge between them? Does the bridge somehow go away in the reflow phase? (Not familiar with reflow at all)
- The_SamminAter 1y agoUsing with a little flux while tinning usually prevents the pads from bridging
- etrautmann 1y agoYes, the surface tension of melted solder pulls the solder to just the pad areas (assuming you don’t have far too much)
- foldr 1y agoTo add to the sister comments, you can quite easily remove such bridges by adding flux and then touching each individual pad with a fine tipped soldering iron. It sometimes takes a few tries, but eventually the solder that’s touching the solder mask will either be wicked onto the iron or move onto one of the neighboring pads. (The trick is to touch just the pads with the iron, and not to try to attack the solder bridge itself.)
- amelius 1y agoMake sure there is soldermask between the pads. This makes soldering much easier! (If your foundry can't fabricate it, then make the pads thinner until they can fabricate the soldermask.)