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No, this is panels from which interposers will be made. Which are now larger than chips and rectangular, so wasted edges from a 300mm wafer are high. The prop
by TanjB 2y ago
No, this is panels from which interposers will be made. Which are now larger than chips and rectangular, so wasted edges from a 300mm wafer are high. The proposed size is much larger than chip-grade ingots.
They don't need perfect silicon. It can be grown on a continuous ribbon which is sliced into panel sizes like they do for solar cells. If they need a perfect surface they can deposit some pure Si to finish it. Maybe we will eventually see that replace ingots for chip grade.
- specialist 2y agoTIL https://en.wikipedia.org/wiki/Interposer https://en.wikipedia.org/wiki/Interposer The interposer is the layer between chips and their package. Per RTFA, TMSC is trying to fit more chips per interposer. Neat.