Around this era there was a trend to do Package-on-Package assembly of the SoC and DRAM. There were a lot of TI OMAP designs with this in place and it made fina

Around this era there was a trend to do Package-on-Package assembly of the SoC and DRAM. There were a lot of TI OMAP designs with this in place and it made final PCB design and assembly a lot easier. I'm guessing thermal concerns eventually killed this idea. Maybe SIPs like Octavo's design are really the future.