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For die photos, you want a metallurgical microscope, one that shines light down through the lens. A typical microscope shines the light from underneath, which w
by kens 4y ago
For die photos, you want a metallurgical microscope, one that shines light down through the lens. A typical microscope shines the light from underneath, which works well for biological samples, but not so well for chips.
The tricky part is decapping the chip. The easy way is to get a ceramic package, which you can decap with a chisel. Or a metal can, which you can open with a hacksaw. With a standard epoxy package, you can heat it with a hot air gun and twist it, and you have maybe 50% chance of the die separating from a package. The best way for epoxy packages is boiling sulfuric and/or nitric acid, which has obvious issues.
The other aspect is that you need to stitch together a bunch of images to get a high-resolution photo. I use Hugin, which lets just say that it has a learning curve.
- krzrak 4y agoThank you for your informative answer.
- deleted 4y ago[deleted]
- dekhn 4y agoHave you tried ImageJ, specifically the Grid/Collection Stitching? I use it for microscope stitching and it works pretty well.
- BarsMonster 4y agoI tried it at the beginning, but found it quite complicated. A the moment Hugin is used, which works nearly perfectly, especially on XY stage where you can disable frame rotation optimization.
- omoikane 4y agoThis same site has an article on laser decapsulation not too long ago: https://zeptobars.com/en/read/laser-decapsulation-fail-not-so-fast https://zeptobars.com/en/read/laser-decapsulation-fail-not-s... It appears to not work so well, but the video looked very cool.