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Photographing a Raspberry Pi 2 with Xenon flash makes it power down (2015)

• deleted 5y ago
  [deleted]
• sokoloff 5y ago
  (2015)
• pkilgore 5y ago
  Previously here: https://news.ycombinator.com/item?id=24818232 https://news.ycombinator.com/item?id=24818232 (3 comments)
• cypherpunks01 5y ago
  Curious, were they successfully able to make future Pis immune to this?
  • emwjacobson 5y ago
    In newer boards there is a metal shield covering the chip
• amelius 5y ago
  The reason could be the same as given in the other RPi post today (about the Pi Zero 2W): > The black rectangle is a "bare-die soldered bumped package"... what that means is the silicon die has no black epoxy covering. A metal layer is deposited on the die and then solder bumps attached which allow the part to be soldered to a PCB. The reason for this, is as expected, cost. No package (epoxy, substrate)... no cost. One sees this more-and more with electronic assemblies. > The only downside is that external light can actually affect the chip operation (light hitting the die releases electrons at PN junctions creating errors in circuit operation ) .. .however here the Faraday metal shield helps prevent this. http://electronupdate.blogspot.com/2021/11/raspberry-pi-zero-2w-what-does-silicon.html http://electronupdate.blogspot.com/2021/11/raspberry-pi-zero...
• deleted 5y ago
  [deleted]