AFAIK, some (less than?) 2% of energy put into the EUV source ends up at the wafer. The EUV-source has been the biggest struggle for ASML from what I gathered i

AFAIK, some (less than?) 2% of energy put into the EUV source ends up at the wafer. The EUV-source has been the biggest struggle for ASML from what I gathered in media. Apparently, tiny droplets of tin are created by spinning some disk(s) and then those droplets are zapped with with a laser before they emit EUV. Those machines are crazy complex.