Lind5

16 ms·

91.
by Lind5 6y ago
This may be useful https://semiengineering.com/knowledge_centers/communications...
92.
Huawei: 5G Is About Capacity, Not Speed: One-on-one with CTO Paul Scanlan(semiengineering.com)
14 points by Lind5 6y ago|3 comments
93.
From Cloud to Cloudlets(semiengineering.com)
2 points by Lind5 6y ago|0 comments
94.
The Next Leap: The race to increase performance by orders of magnitude(semiengineering.com)
4 points by Lind5 6y ago|0 comments
95.
Power And Performance Optimization At 7/5/3nm(semiengineering.com)
7 points by Lind5 6y ago|0 comments
96.
5G Brings New Testing Challenges(semiengineering.com)
2 points by Lind5 6y ago|0 comments
97.
Problems and Solutions in Analog Design(semiengineering.com)
3 points by Lind5 6y ago|0 comments
98.
The Evolution of Digital Twins(semiengineering.com)
1 points by Lind5 6y ago|1 comments
99.
RISC-V Gaining Traction(semiengineering.com)
4 points by Lind5 6y ago|0 comments
100.
Memory Access in AI Systems [video](semiengineering.com)
2 points by Lind5 6y ago|0 comments
101.
Designing for Extreme Low Power(semiengineering.com)
4 points by Lind5 6y ago|0 comments
102.
Speeding Up The R&D Metrology Process(semiengineering.com)
1 points by Lind5 6y ago|0 comments
103.
Different Types of AI Hardware [video](youtu.be)
2 points by Lind5 6y ago|0 comments
104.
What’s After 5G(semiengineering.com)
1 points by Lind5 6y ago|2 comments
105.
Time to Watch China’s Equipment Efforts(semiengineering.com)
2 points by Lind5 6y ago|0 comments
106.
Spiking Neural Networks Place Data in Time(semiengineering.com)
1 points by Lind5 6y ago|0 comments
107.
Smaller Nodes, Much Bigger Problems(semiengineering.com)
1 points by Lind5 6y ago|0 comments
108.
Moving Data and Computing Closer Together(semiengineering.com)
2 points by Lind5 6y ago|0 comments
109.
Winners and Losers at the Edge(semiengineering.com)
2 points by Lind5 6y ago|0 comments
110.
Chip Reliability vs. Cost(semiengineering.com)
3 points by Lind5 6y ago|0 comments
111.
Challenges In Building Smarter Systems: A look at the intelligence in devices(semiengineering.com)
1 points by Lind5 6y ago|0 comments
112.
The Next Advanced Packages(semiengineering.com)
1 points by Lind5 6y ago|0 comments
113.
ML Opening New Doors for FPGAs(semiengineering.com)
2 points by Lind5 6y ago|0 comments
114.
2020 CEO Outlook for Chip Industry(semiengineering.com)
1 points by Lind5 6y ago|0 comments
115.
by Lind5 6y ago
per the article: -SMIC is shipping 14nm finFETs, with a 7nm-like process in R&D. -Yangtze Memory Technologies (YMTC) recently entered the 3D NAND market with a 64-layer device. A 128-layer technology is in R&D. -ChangXin Memory Tech
116.
by Lind5 6y ago
Several foundries are ramping up their new 5nm processes in the market, but now customers must decide whether to design their next chips around the current transistor type or move to a different one at 3nm and beyond https://semi
117.
Spreading Out the Cost at 3nm(semiengineering.com)
2 points by Lind5 6y ago|0 comments
118.
Different Levels of Interconnects(youtu.be)
1 points by Lind5 6y ago|0 comments
119.
Challenges for Compute-in-Memory Accelerators(semiengineering.com)
2 points by Lind5 6y ago|0 comments
120.
by Lind5 6y ago
There are big shifts in the economics of security technology https://semiengineering.com/fundamental-changes-in-economics... . More and higher value data, thinner chips and a shifting customer base are forcing long-overdue

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