3 ms·
In my experience (Flash Platforms Group, HSGT), a significant number of flash device failures are caused by mechanical issues, such as: on-die faults, wire bond
by linker3000 11y ago
In my experience (Flash Platforms Group, HSGT), a significant number of flash device failures are caused by mechanical issues, such as: on-die faults, wire bonding problems and solder joint/package stresses which may occasinally be down to a production issue, but are more often attributed to rough handling during installation or thermal stress. This is less of an issue with SFF SSDs, but especially true of PCIe products crammed into 2U servers with poor airflow.
In general, thermals tend to be a significant issue for all form factors when devices are retrofitted. Less so for 'products' (All flash arrays etc.) which are designed as whole products from the outset.
This creates a failure pattern that is totally separate from predictable wear due to use and means that 'they'll all die at the same time' becomes much less certain for some categories of device.
- deelowe 11y agoThat's what I had considered as well. Specifically, that the wear out failures are on the right hand of the curve, meaning that other issues would tend to dominate. What you said makes a lot of sense: failures due to thermal/electrical stress, manufacturing issues, and handling. Also, there's the controllers, which tend to be a significant source for issues. So yeah, maybe theoretically, the wear out would be a concern for raid. However, practically this is rarely an issue as other failures randomize the distribution enough to where this never causes a problem in-situ.