I'd of thought the central connecting holes that are used to link the wafers together as a bus also act as heatsink to blance heat across the stack. Also with

I'd of thought the central connecting holes that are used to link the wafers together as a bus also act as heatsink to blance heat across the stack. Also with the lower speeds used, heat will be less and may be the limit currently to avoid warping of individual wafers in the stack. As for desktops etc, one avenue this does open up would be a more standard socket perhaps as the CPU can change and sits on another socket in effect, allowing changes to be done at that level to maybe stretch out sockets some CPU's would normally never reach.