3 ms·
Packaging is indeed critical to get heat out. There have been some cool (no pun intended) developments on this front such as the DirectFET [1], LFPAK [2] [1] h
by dskhatri 11y ago
Packaging is indeed critical to get heat out. There have been some cool (no pun intended) developments on this front such as the DirectFET [1], LFPAK [2]
[1] http://www.irf.com/technical-info/whitepaper/directfet.pdf http://www.irf.com/technical-info/whitepaper/directfet.pdf
[2] http://www.nxp.com/documents/leaflet/939775016838_LR.pdf http://www.nxp.com/documents/leaflet/939775016838_LR.pdf
[3]
- madengr 11y agoInteresting. I have never seen RF power parts in flip-chip, but I suppose there is no reason why they couldn't. Now Cree did have a 25W, 3 GHz FET in SO-8 package, which is kind of strange given package inductance, but they are have moved to QFN now.