3 ms·
Man, even at 20nm, the die size must be a bear. Especially the L3$... I know TSMC has a ~600mm^2 max (for remotely reasonable yields), even on the highly mature
by neilmovva 12y ago
Man, even at 20nm, the die size must be a bear. Especially the L3$... I know TSMC has a ~600mm^2 max (for remotely reasonable yields), even on the highly mature 28nm process. Thus, I doubt this would be a viable chip for deployment today, rather a proof of concept. Need more details to be sure though.
- wmf 12y agoCache is repairable and bad cores can be disabled, so yield might not be too bad. I doubt Oracle is concerned about cost, though.