3 ms·

It's both! http://i00.i.aliimg.com/wsphoto/v0/1639827880/Free-shipping-5PCS-QG80331M500-SL9BE.jpg http://i00.i.aliimg.com/wsphoto/v0/1639827880/Free-shipping-..

• Gracana 12y ago
  Assuming someone downvoted because they didn't understand or felt I didn't explain enough... That chip in the picture (the intel QG80331M500, the chip in question) is a flip chip package; instead of using wire bonds to connect to pads on the die, it has solder balls like a BGA package. The chip is soldered down to a carrier PCB and an underfill glue/sealant is applied around it, so the only thing exposed is the bare back of the die. There is no plastic package to laser-engrave, the engraving is done right on the silicon.