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"The markings are laser etched directly onto the surface of the silicon die." That's the package, not the silicon die.
by patcheudor 12y ago
"The markings are laser etched directly onto the surface of the silicon die."
That's the package, not the silicon die.
- Gracana 12y agoIt's both! http://i00.i.aliimg.com/wsphoto/v0/1639827880/Free-shipping-5PCS-QG80331M500-SL9BE.jpg http://i00.i.aliimg.com/wsphoto/v0/1639827880/Free-shipping-...
- Gracana 12y agoAssuming someone downvoted because they didn't understand or felt I didn't explain enough... That chip in the picture (the intel QG80331M500, the chip in question) is a flip chip package; instead of using wire bonds to connect to pads on the die, it has solder balls like a BGA package. The chip is soldered down to a carrier PCB and an underfill glue/sealant is applied around it, so the only thing exposed is the bare back of the die. There is no plastic package to laser-engrave, the engraving is done right on the silicon.