its not missing it, its just a specific packaging type (flip chip). Its supposed to be used in products with full enclosure, or under a heatsink. For example a

its not missing it, its just a specific packaging type (flip chip). Its supposed to be used in products with full enclosure, or under a heatsink. For example almost every single CPU and GPU nowadays uses some fcbga packaging (flip chip on ceramic/pcb carrier), but they are all hidden under heatsinks and often additional heat spreaders. http://www.maximintegrated.com/en/app-notes/index.mvp/id/4002 http://www.maximintegrated.com/en/app-notes/index.mvp/id/400...