4 ms·

I don't think it happens at the chip level.Chip fabs have pretty good respect for IP.

• ChuckMcM 12y ago
  When I was at Intel we saw "breakage" at the packaging level, basically once die were packaged they would be run through a tester and a fraction of the parts would bin out (fail characterization testing). In theory those bad chips were ground up and recycled, sometimes they went missing. (this was back in the late 80's early 90's) At the time Intel invested in ways of tracking chips back through the process when those chips showed up in the market the source of the leak could be plugged. It is entirely unclear to me if companies like AllWinner which make a bunch ARM chips has similar sorts of controls.