> Exciting times! Agreed! Yeah, the Squink Kickstarter is sorely lacking in information. They don't give trace width and spacing specs, etc. I also like tha

> Exciting times! Agreed! Yeah, the Squink Kickstarter is sorely lacking in information. They don't give trace width and spacing specs, etc. I also like that AgIC uses off the shelf printer hardware and can manage high resolution. However, I'm skeptical you can do much more than OSHPark with 0.4mm BGAs. The challenge with OSHPark design rules is the breakout, and here you have one (maybe two?) layers, so again, you can't manage much of a ball grid. Although these projects are exciting, I can't seem them replacing cheap PCB fabs + reflow oven for my own prototyping projects. So then question becomes, how do you take the next step? Maybe you can print on FR-4 or pre-preg, use optical alignment to handle registration and glue multiple layers together with conductive glue to achieve multi-layer boards. For ground planes, maybe you choose some layers pre-clad with copper. I'm not sure what to do about vias. You could think about using layers with a selection of various pre-made vias, but again, it is hard to see how that would work with large BGAs. So you have to include a drill and find some way to plug/fill the vias.