4 ms·
Lots of issues will need to be worked out for this to be viable. 4 layers minimum (ground, power, 2 routing planes). High pitch TSOP and BGA need tight pitches
by pkaye 12y ago
Lots of issues will need to be worked out for this to be viable. 4 layers minimum (ground, power, 2 routing planes). High pitch TSOP and BGA need tight pitches and traces. The width of traces and spacing and dielectric material need tight tolerances for impedance control for signal integrity.
But they are not asking for much of an investment so it may be worthwhile to try it out.
- cushychicken 12y agoThat's assuming a level of complexity this doesn't appear to be shooting for. Sure, you probably couldn't build an RPi or BBB with this guy, but it seems that they're targeting a lower end shop trying to spin a few iterations of a low-cost IoT device before sending it out to a fab house. The level of complexity needed for that hardware isn't huge.
- TylerE 12y agoI could also see e.g. the guys handbuilding guitar effects going nuts over something like this.
- cushychicken 12y agoYes! That would be great. So much more consistent than handsolder.