There's also wire bonding at the edge, requires different size die: http://electroiq.com/blog/2010/10/vertical-die-stacking-goes-3d-without-tsv/ http://electroi

There's also wire bonding at the edge, requires different size die: http://electroiq.com/blog/2010/10/vertical-die-stacking-goes-3d-without-tsv/ http://electroiq.com/blog/2010/10/vertical-die-stacking-goes...