3 ms·
Depends on the alloy, tin/bismuth will melt around 140C. I would've expected over 180C to be necessary as well though. Sn63Pb37 is very common and melts at 180C
by ics 13y ago
Depends on the alloy, tin/bismuth will melt around 140C. I would've expected over 180C to be necessary as well though. Sn63Pb37 is very common and melts at 180C, but since it has lead I don't think it's used much in large scale electronics manufacture.
- throwwit 13y agoI read somewhere the xbox gpu problem was a result of the lead-free solder used to meet environmental regulations.
- fnordfnordfnord 13y agoIf your electronics are RoHS compliant (they are), there is no lead.
- kevinchen 13y agoApple's laptops are RoHS, so the melting point of that lead-free solder should be even higher than 183 C.