No BGAs, I think you might be seeing the crazy thermal via arrays under the chips (I went a little overboard, the next revision will likely have a couple less v

No BGAs, I think you might be seeing the crazy thermal via arrays under the chips (I went a little overboard, the next revision will likely have a couple less vias on each chip). The hashing ICs are QFN. This would be a really easy board to manufacture. Low unique part count. I just need to move the decoupling cap vias out of pad and it'll be ready.