2 ms·
I think two obvious ways forward are * Increasing the die size (feasable by reducing substrate costs) * Stacking transistors (3D CPU's)
by Confusion 17y ago
I think two obvious ways forward are
* Increasing the die size (feasable by reducing substrate costs)
* Stacking transistors (3D CPU's)
- albertcardona 17y agoHopefully they'll (re)invent blood vessels along the way--a.k.a. an effective heat removal system like our brains have.