Cool !. Maybe 3D isn't ready yet, but at least 2.5D integration is already in the market in FPGA's , and there's some claims from some companies[1] that it's r

Cool !. Maybe 3D isn't ready yet, but at least 2.5D integration is already in the market in FPGA's , and there's some claims from some companies[1] that it's ready for market for low cost applications. [1]http://www.eetimes.com/electronics-products/electronic-product-releases/microcontroller-mcu/4411509/Silex-Microsystems-and-BroadPak-Bring-2-5D-IC-Packaging-Capabilities-to-the-Mainstream-Market-through-Low-Cost-High-Performance-Silicon-Interposers http://www.eetimes.com/electronics-products/electronic-produ...