3 ms·
My spouse did her EE master's thesis on 3D integration. Trust me, the technology is definitely not close by.
by MichaelSalib 13y ago
My spouse did her EE master's thesis on 3D integration. Trust me, the technology is definitely not close by.
- ippisl 13y agoCool !. Maybe 3D isn't ready yet, but at least 2.5D integration is already in the market in FPGA's , and there's some claims from some companies[1] that it's ready for market for low cost applications. [1]http://www.eetimes.com/electronics-products/electronic-product-releases/microcontroller-mcu/4411509/Silex-Microsystems-and-BroadPak-Bring-2-5D-IC-Packaging-Capabilities-to-the-Mainstream-Market-through-Low-Cost-High-Performance-Silicon-Interposers http://www.eetimes.com/electronics-products/electronic-produ...