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One solution to this using conventional CMOS technology is to use 3D stacking, where each layer uses a different technology.
by interconnector 14y ago
One solution to this using conventional CMOS technology is to use 3D stacking, where each layer uses a different technology.
- ippisl 14y agoYou're right , but that's a pretty difficult and expensive solution. The more practical solution for now is 2.5D stacking - stacking all the un-packaged chips on silicon/glass die instead of a pcb. That's already being used in some fpga and communications equipment. But 2.5d is still pretty expensive and complex. Not yet ready for low cost stuff.