4 ms·
Wouldn't this have heat dissapation issues?
by tocomment 14y ago
Wouldn't this have heat dissapation issues?
- interconnector 14y agoFrom what I've read, through silicon thermal vias are used to remove heat from thermal hotspots to the heat sink.
- crusso 14y agoFrom reading the article, it seems that the claim is that most of the power is used in communicating with the rest of the system - and that is handled by only a part of the cube structure. The rest of the cube uses a lot less power, so would generate far less heat than normal DDRx chips.