3 ms·
The critical back end step for HBM is thermal compression bonding - where they actually compress 13 very thin die separated by solder balls. Cracking is a major
by xadhominemx 14d ago
The critical back end step for HBM is thermal compression bonding - where they actually compress 13 very thin die separated by solder balls. Cracking is a major issue.
- pixl97 14d agoWe are getting so many technologies like this that are so insanely specialized and require such deep knowledge of physical processes that some event like a 1918 flu that kills 10% of the population could take out enough people that we'd be unable to make things like this for years as we fill in the missing knowledge workers. It's just crazy how far down the scale we're tickling atoms these days.
- benj111 14d agoSurely we'd have had the same issue during the Spanish flu? Any examples?