4 ms·
Yeah, the scale is kind of mind-bending. You're taking something that's already extremely fragile, grinding most of its thickness away, handling it through seve
by KurSix 8d ago
Yeah, the scale is kind of mind-bending. You're taking something that's already extremely fragile, grinding most of its thickness away, handling it through several more process steps, and somehow doing that cheaply enough for mass-market products.
- lazide 8d agoAutomation, automation, automation. Zero chance you could do it if a human had to touch the die/chip directly during those steps. But clean room + vacuum pick and place machine? A matter of fine tuning, and it should work just fine.
- xadhominemx 8d agoThe critical back end step for HBM is thermal compression bonding - where they actually compress 13 very thin die separated by solder balls. Cracking is a major issue.
- pixl97 7d agoWe are getting so many technologies like this that are so insanely specialized and require such deep knowledge of physical processes that some event like a 1918 flu that kills 10% of the population could take out enough people that we'd be unable to make things like this for years as we fill in the missing knowledge workers. It's just crazy how far down the scale we're tickling atoms these days.
- benj111 7d agoSurely we'd have had the same issue during the Spanish flu? Any examples?