3 ms·
I did find it funny recently when Huawei when talking about its folded logic say the Vertical Bonding Pitch's are every 15,000 angstroms. It is a very fancy way
by FlowingRiver 9d ago
I did find it funny recently when Huawei when talking about its folded logic say the Vertical Bonding Pitch's are every 15,000 angstroms. It is a very fancy way of saying an interconnect every 1.5 microns.
- AnotherGoodName 9d agoThey should just say every 7 silicon atoms at that point.
- fc417fc802 9d ago7500 surely? But yeah at this point I feel like the diameter of a silicon atom would make for a better unit of measure.
- AnotherGoodName 9d agoOh right i was thinking the feature size (about that many namometers not microns)