What's really interesting is that if you scale it to higher densities (eg 3nm and stacked die) with ComputeInMemory for fp8 you can reasonably start to fit 30B-

What's really interesting is that if you scale it to higher densities (eg 3nm and stacked die) with ComputeInMemory for fp8 you can reasonably start to fit 30B-70B models. With MoE and multiple stacked die, just like HBM, you could fit an open weight near frontier 1T model (like GLM5.2) at similarly much lower power <10kW and high token rates >2ktps. For running a bunch of agents where fill rate and speed/latency are important it may not matter that you're 6-18mo behind on weights. The process for the chip design could be largely automated, and new silicon pumped out as new weights are available (with a 3-6mo delay).