3 ms·
> Typically no solder paste is used, just flux. Ah, so reflow the solder on the package ends then? And I assume they have a fancy precision process for “tinnin
by SV_BubbleTime 2mo ago
> Typically no solder paste is used, just flux.
Ah, so reflow the solder on the package ends then? And I assume they have a fancy precision process for “tinning” the ends?
- IndrekR 2mo agoThe (more common) package has very precise solder bumps. You can have a special order for one with ENIG finish as well, but this only makes sense if you have a really good use case (using Pb solder, wirebonding directly). Not sure what method is used to deposit this solder. Probably just stencil on wafer before slicing.