The inverse is true: This removes heat from the internal compartments (which logic board heat sink and battery co-habitate [0]) by transferring it outside via

The inverse is true: This removes heat from the internal compartments (which logic board heat sink and battery co-habitate [0]) by transferring it outside via heat conduction through the case. There is no detectible heat increase (to touch) — consider the heat masses relative sizes (processor v. entire metal case). [0] See <https://www.youtube.com/watch?v=jXY9tCBpf48&t=188 https://www.youtube.com/watch?v=jXY9tCBpf48&t=188> — thermal pad placement goes between four central screws (above processor) As a thought experiment: how would ejecting heat from the inside increase its temperature?