4 ms·
Hot plate, flux pen, hot air gun. Important caveat: The downside to this is you can't inspect it (without an x-ray machine), and if you screw up, you're going
by the__alchemist 8mo ago
Hot plate, flux pen, hot air gun.
Important caveat: The downside to this is you can't inspect it (without an x-ray machine), and if you screw up, you're going to need a new chip (Re-balling does not look approachable/time-efficient)
- nxobject 8mo agoThank makes sense, thank you! Is there a rule of thumb for how high you set the hot plate? I’d be worried about SMD components on the side in contact with the hotplate.
- the__alchemist 8mo agoYou're right that that is a concern. I think I set mine for 190C? Don't remember. But as you infer, my goal is to get it slightly below melting temperature so the the other components' solder doesn't melt. (Disaster if they do, then the board gets jostled or you knock a component with tweezers). Then when you hit it with the air, just that component melts. Also, it seems to not melt if you don't flux the pads prior. Not really sure why.
- estimator7292 8mo agoReballing isn't too difficult. It's mostly about buying all the special tools and supplies. You need a specific template for each BGA pad layout and jars of the right size solder balls. Some people also just put solder paste on the PCB with a stencil and reflow that into solder bumps that you then solder the chip to. I find that method suspect but if it works it works