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Rapidus explores panel-level packaging on glass for next-gen processors
- soruly 11mo agoIt seems the square "wafer" (silicon substrate) is developed by Mitsubishi Materials a year ago. https://www.mmc.co.jp/corporate/en/news/2024/news20240821.html https://www.mmc.co.jp/corporate/en/news/2024/news20240821.ht...