Give them enough time and they will. EUV will hit limits anyway in a decade. For china it's DUV+packaging for now, NIL/DSA mid-term, and MoS₂/2D chips long ter

Give them enough time and they will. EUV will hit limits anyway in a decade. For china it's DUV+packaging for now, NIL/DSA mid-term, and MoS₂/2D chips long term. But wafer scale, defect free 2D logic is 20–30 yrs out, so no EUV shortcut anytime soon