3 ms·
We don’t bond heat plates to the top of CPUs due to the coefficient of thrermal expansion right? Isn’t that why we need paste? Because of CoTE was a non issue
by hinkley 2y ago
We don’t bond heat plates to the top of CPUs due to the coefficient of thrermal expansion right? Isn’t that why we need paste?
Because of CoTE was a non issue I would think we could dig heat dissipation channels into the top of chips, maybe Serpinski gasket style. A little proper lapping and you’d get an airtight seal with the heat sink.
- bobmcnamara 2y agoCoTE between nickel plater copper integrated heat spreaders and copper heat pipes can be a non-issue, especially over such a small area. Increasing the effective surface area is an interesting idea, though minimizing the seam thickness also works to reduce the thermal resistance of the joint, and seems to be more common.