There's a lof of innovation in optical interconnect, including at the chip-to-chip and die-to-die levels: https://www.eetimes.com/silicon-photonics-and-co-pack

There's a lof of innovation in optical interconnect, including at the chip-to-chip and die-to-die levels: https://www.eetimes.com/silicon-photonics-and-co-packaged-optics-shine-a-light-at-ofc-2025/ https://www.eetimes.com/silicon-photonics-and-co-packaged-op...