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I will give you this anecdote: I find BGA easier to solder than QF[N|P]. Most soldering errors I make are due to inappropriate amount or uneven solder applicati
by the__alchemist 2y ago
I will give you this anecdote: I find BGA easier to solder than QF[N|P]. Most soldering errors I make are due to inappropriate amount or uneven solder application. No factor if the solder is pre-applied.
- foldr 2y agoIn production manufacturing solder paste is generally applied to BGA pads. The amount of solder in the balls is less than the ideal amount for making a good joint, and the solder paste also helps to hold the component in position. That said, I have ‘successfully’ soldered small BGA components by just applying a sticky flux and then reflowing with a hot air gun. It can work fine for prototypes, but it’s not really how the packages are meant to be soldered.
- the__alchemist 2y agoGood info. I forgot about the flux... Concur. I had trouble without flux, but relative ease with. Haven't tried paste on the pads. Plate + air works better than air alone IMO.