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BGAs and LGAs are the devil, sure. But anyone who can't handle QFNs and DFNs has no business calling themselves a modern electronics shop. (Regular QFNs, I mea
by exmadscientist 2y ago
BGAs and LGAs are the devil, sure. But anyone who can't handle QFNs and DFNs has no business calling themselves a modern electronics shop.
(Regular QFNs, I mean. Dual-row QFNs are sick jokes, and I maintain that triple-row QFNs are just figments of my nightmares, and I won't listen to anyone who says otherwise.)
- the__alchemist 2y agoI will give you this anecdote: I find BGA easier to solder than QF[N|P]. Most soldering errors I make are due to inappropriate amount or uneven solder application. No factor if the solder is pre-applied.
- foldr 2y agoIn production manufacturing solder paste is generally applied to BGA pads. The amount of solder in the balls is less than the ideal amount for making a good joint, and the solder paste also helps to hold the component in position. That said, I have ‘successfully’ soldered small BGA components by just applying a sticky flux and then reflowing with a hot air gun. It can work fine for prototypes, but it’s not really how the packages are meant to be soldered.
- the__alchemist 2y agoGood info. I forgot about the flux... Concur. I had trouble without flux, but relative ease with. Haven't tried paste on the pads. Plate + air works better than air alone IMO.