The statement is correct; it's not on the substrate similar to AMD's 3D cache or it doesn't use interposer like HBM. You can consider it like a small PCB that

The statement is correct; it's not on the substrate similar to AMD's 3D cache or it doesn't use interposer like HBM. You can consider it like a small PCB that has the CPU die and the memory soldered very closely nearby (and like mentioned +memory channels)