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It's not in the package? TIL... My misunderstanding seems to be common across the interwebs. I remember Apple used to show slides depicting the M1 SoC as one u
by pavlov 2y ago
It's not in the package? TIL... My misunderstanding seems to be common across the interwebs.
I remember Apple used to show slides depicting the M1 SoC as one unit containing a CPU, GPU, Neural Engine, cache, and DRAM all together. But slides shown at an Apple event definitely qualify for artistic license.
- jsheard 2y agoThe memory is soldered on top of the package, here's an actual real life photo of the M1 package with two LPDDR packages sitting on it: https://en.wikipedia.org/wiki/Apple_M1#/media/File:Mac_Mini_M1_chip.jpg https://en.wikipedia.org/wiki/Apple_M1#/media/File:Mac_Mini_... You could call that on-package, but it's not on-package in the same way that GPU HBM is, with that the main die and memory dies are packaged together on the same substrate. That's a much more difficult and expensive process, apparently packaging is the main bottleneck for H100/H200 production. https://i.imgur.com/hFTPyjk.jpeg https://i.imgur.com/hFTPyjk.jpeg
- ein0p 2y agoNor is it a chiplet, in which case it would qualify as "in-SoC".
- nomel 2y agoFor that H100 image, how do they get the top surface of all the chips on the same plane? Do they solder them "upside down", so the chips are sitting on a reference plane, and the PCB is allowed to "float"? Or is the soldering controlled enough that they can just heat and be done?
- TiredOfLife 2y agoWait till you learn that unified memory was in common use by pc's long before Apple "invented" it.