> For NIL to become a mainstream chipmaking technology, it must overcome several challenges. Defects are a big concern—tiny particles or imperfections on the mo

> For NIL to become a mainstream chipmaking technology, it must overcome several challenges. Defects are a big concern—tiny particles or imperfections on the mould can create repeating flaws across entire wafers. Alignment is another hurdle. Since chips are built in layers, the circuit patterns of every layer must line up precisely. The one major advantage NIL has over optical techniques is that it does not require multiple patterning to address edge cases: https://en.wikipedia.org/wiki/Multiple_patterning https://en.wikipedia.org/wiki/Multiple_patterning