> uses an _embedded_ silicon interposer It sounds like they're using TSMC's new LSI (Local Si Interconnect) technology, which is their version of Intel's EMIB.

> uses an _embedded_ silicon interposer It sounds like they're using TSMC's new LSI (Local Si Interconnect) technology, which is their version of Intel's EMIB. It's essentially small islands of silicon, just around the inter-chip connections, embedded within the organic substrate. This gives the advantages of silicon interconnect, without the cost and size restrictions of a silicon interposer. It would not be visible from just looking at the package. https://www.anandtech.com/show/16031/tsmcs-version-of-emib-lsi-3dfabric https://www.anandtech.com/show/16031/tsmcs-version-of-emib-l... https://semianalysis.com/2022/01/06/advanced-packaging-part-2-review/ https://semianalysis.com/2022/01/06/advanced-packaging-part-...