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FTFA > Apple’s custom-built UltraFusion packaging technology uses an embedded silicon interposer that connects two M3 Max dies across more than 10,000 signals,
by Teever 2y ago
FTFA
> Apple’s custom-built UltraFusion packaging technology uses an embedded silicon interposer that connects two M3 Max dies across more than 10,000 signals, providing over 2.5TB/s of low-latency interprocessor bandwidth, and making M3 Ultra appear as a single chip to software.
- InTheArena 2y agoI RTFA, RMFP The comment was that the press had reported that the interposer wasn't available. This obviously uses some form of interposer, so the question is if the press missed it, or Apple has something new.
- nsteel 2y ago> uses an _embedded_ silicon interposer It sounds like they're using TSMC's new LSI (Local Si Interconnect) technology, which is their version of Intel's EMIB. It's essentially small islands of silicon, just around the inter-chip connections, embedded within the organic substrate. This gives the advantages of silicon interconnect, without the cost and size restrictions of a silicon interposer. It would not be visible from just looking at the package. https://www.anandtech.com/show/16031/tsmcs-version-of-emib-lsi-3dfabric https://www.anandtech.com/show/16031/tsmcs-version-of-emib-l... https://semianalysis.com/2022/01/06/advanced-packaging-part-2-review/ https://semianalysis.com/2022/01/06/advanced-packaging-part-...