3 ms·
Complicating the issue is that this was also an early generation of chiplet so there are two levels of bga. motherboard to processing unit and processing unit t
by somat 2y ago
Complicating the issue is that this was also an early generation of chiplet so there are two levels of bga. motherboard to processing unit and processing unit to chip_actual. the latter commonly are referred to as "bumps" to distinguish from "bga" which attaches the chip_structure to the mother board. A lot of the problem was in the bumps for this chiplet like sub assembly. and while reballing bga is a tricky but well understood process. my understanding is that reballing bumps is nearly impossible.
- throwaway48476 2y agoIt's called FCBGA, flip chip ball grid array. The only other option for packaging is wire bonding but that doesn't scale well with pin count. Technically you could recall and repackage the dies but you'd need millions of dollars in equipment.