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> 3. Allowing Intel to handle the packaging process for TSMC's Arizona-based operations. WTF does that achieve? TSMC fabs all the advanced chips and Intel beco
by UncleOxidant 2y ago
> 3. Allowing Intel to handle the packaging process for TSMC's Arizona-based operations.
WTF does that achieve? TSMC fabs all the advanced chips and Intel becomes just a packager? Window dressing.
- silisili 2y agoFor anyone else like me who wasn't familiar with what semiconductor packaging is - https://news.skhynix.com/semiconductor-back-end-process-episode-2-semiconductor-packaging/ https://news.skhynix.com/semiconductor-back-end-process-epis...
- georgeburdell 2y agoPackaging is gobbling up more and more of the backend process, especially for chiplets.
- inverted_flag 2y agoCurrently, all the Arizona-made chips have to be sent back to Taiwan for packaging, which defeats the purpose of having the fab in the US in the first place.
- matthewfcarlson 2y agoIsn't this sort of like Ford announcing they'll just package Toyota engines into cars? I don't think anyone would call a car window dressing? Packaging has become far more than just coat chip in epoxy/plastic and bond wires onto die.
- UncleOxidant 2y agoNo, not like ford packaging toyota engines into Ford cars. These still won't be Intel chips. Nor will they be sold by Intel (like Ford might sell Ford Branded cars with Toyota engines). Intel would just do that final packaging step for TSMC. It doesn't help Intel develop their fabs or process tech - which is what we want to have some US manufacturer(s) able to continue doing. It just gets Intel some packaging biz which they likely don't even want.