> JLC never added the pour for me. Not even for larger boards. Not sure this is up to date. It seems to depend on the design - how close you are to the design

> JLC never added the pour for me. Not even for larger boards. Not sure this is up to date. It seems to depend on the design - how close you are to the design limits and how much copper is exposed on the outer layers. A message someone got from JLC for an open source project recently: > When the copper pour is less than 30% of board area, we suggest to keep at least 0.15mm trace spacing. > Or the dry film debris might have chance make short circuit, it will make quality control more difficult