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3D-Cache blows Intel out of the water and has absolutely nothing to do with TSMC. Same goes for the clever chiplet design.
by jorvi 2y ago
3D-Cache blows Intel out of the water and has absolutely nothing to do with TSMC. Same goes for the clever chiplet design.
- modeless 2y agoThis is false. 3D VCache is enabled by TSMC's 3DFabric packaging. It also didn't really play a role in AMD passing Intel. Chiplets are also enabled by TSMC technology, CoWoS.
- jorvi 2y ago> 3D VCache is enabled by TSMC's 3DFabric packaging > Chiplets are also enabled by TSMC technology, CoWoS. Interesting, my mistake. Thank you for pointing that out!
- wmf 2y agoBut AMD decided to use those technologies and Intel decided not to. AMD on TSMC N4 is beating Intel on TSMC N3 because AMD has better designs.
- modeless 2y agoWhen AMD passed Intel, they hadn't even decided to use TSMC at all yet. Of course now Intel is behind in leveraging TSMC technology. They started late.