I think "packaging" here refers to the process of putting the silicon die in its plastic casing and connecting the die's pad to the case's pins, see https://en.

I think "packaging" here refers to the process of putting the silicon die in its plastic casing and connecting the die's pad to the case's pins, see https://en.wikipedia.org/wiki/Integrated_circuit_packaging https://en.wikipedia.org/wiki/Integrated_circuit_packaging